合成法疏松多孔类球形二氧化硅微粉
合成法疏松多孔类球形二氧化硅微粉
发货
规格
2,4,7
安徽壹石通材料科技股份有限公司上海分公司
上海 闵行区
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<b><span><span>疏松多孔软硅 类球形多孔二氧化硅</span><span></span></span></b>
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<b><span><span>一、什么是软硅?</span><span></span></span></b>
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<span><span>软硅是壹石通公司自主开发的一种新型的具有疏松多孔结构的类球形二氧化硅粉体材料,具有比重轻、粒度分布集中、流动性好、与树脂的相容性好、固化后无界面等特点。</span><span></span></span>
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<b><span><span>二、软硅与沉淀法白炭黑的区别是什么?</span><span></span></span></b>
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<span><span>答:沉淀法白炭黑是“纳米颗粒团聚体”,在外力作用下可被分散,增稠性及触变性非常明显;而软硅则是“真颗粒”,且粒度分布非常集中,具有极特殊的触变调节性。</span><span></span></span>
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<b><span><span>三、在不同应用领域软硅具有哪些特点和作用?</span><span></span></span></b>
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<span>1</span><span><span>、在覆铜板</span><span>CCL</span><span>中,与破碎石英粉相比,软硅的硬度低,流动性好,可以降低</span><span>PCB</span><span>制作过程中钻头磨损程度,提高钻孔精度。</span><span></span></span>
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<span>2</span><span><span>、在环氧树脂和硅橡胶中可通过填充疏松多孔硅微粉来降低固化后的产品收缩率,其特殊的疏松多孔结构可与树脂基体形成互穿网络结构(</span><span>IPN</span><span>),可提高树脂基体的抗拉强度、抗弯强度、韧性和延展性等。</span><span></span></span>
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<span>3</span><span><span>、在轻质塑料应用领域,因为塑料的高分子不能进入到疏松多孔硅微粉的纳米孔中,所以在工程塑料中可将疏松多孔硅微粉视为“空心玻璃微珠”,用于生产低密度(低比重)工程塑料。</span><span></span></span>
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<span>4</span><span><span>、在轻质铝镁合金应用领域,熔融态金属亦不能进入到疏松多孔硅微粉的纳米孔中,这时也可将疏松多孔硅微粉视为“空心玻璃微珠”,而疏松多孔硅微粉不会像空心玻璃微珠那样在高温下产生内部气压升高导致破裂或爆炸的情况。</span><span></span></span>
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<span>5</span><span><span>、在高端薄膜开口剂应用领域,软硅比重仅为球形硅微粉的二分之一,可大大降低生产成本。另外,软硅内部丰富的纳米孔道有利于光的通过,适用于高透明度、高透光率薄膜。</span><span></span></span>
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<b><span><span>四、产品参数表</span><span></span></span></b>
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<span><span>牌号</span><span></span></span>
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<span>SS002D</span>
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<span>SS004D</span>
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<span>SS008D</span>
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<span>SiO2</span>
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<span>%</span>
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<span><span>≥</span><span>99.6</span></span>
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<span><span>≥</span><span>99.6</span></span>
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<span><span>≥</span><span>99.6</span></span><span></span>
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<span><span>粒径(</span><span>D50</span><span>)</span><span></span></span>
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<span><span>μ</span><span>m</span></span>
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<span>1.8-3</span>
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<span>3.5-4.5</span>
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<span>7-9</span><span></span>
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<span>BET</span><span><span>比表面积</span><span></span></span>
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<span>m2/g</span>
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<span>6</span><span><span>±</span><span>2</span></span>
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<span><span>—</span><span></span></span>
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<span><span><</span><span>2</span></span><span></span>
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<span><span>电导率</span><span></span></span>
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<span><span>μ</span><span>S/cm</span></span>
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<span><span>≤</span><span>20</span></span>
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<span><span>≤</span><span>20</span></span>
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<span><span>≤</span><span>20</span></span>
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<span><span>密度</span><span></span></span>
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<span>g/cm3</span>
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<span>2.2</span><span><span>±</span><span>0.3</span></span>
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<span>PH</span><span><span>值</span><span></span></span>
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<span>--</span>
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<span>6.5</span><span><span>±</span><span>1</span></span>
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<span><span>包装</span><span></span></span>
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<span><span>纸塑复合袋</span><span></span></span>
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<span>25kg</span>
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<b><span><span>五、产品特点</span><span></span></span></b>
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<span>1.</span><span><span>颗粒近似球形,极易分散;</span><span></span></span>
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<span>2.</span><span><span>疏松多孔结构,堆比重小;</span><span></span></span>
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<span>3.</span><span><span>吸附性强,吸油值是自身重量</span><span>90%</span><span>;</span><span></span></span>
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<span>4.</span><span><span>度分布极窄,与树脂的相容性好</span><span>, </span><span>固化后无界面。</span><span></span></span>
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