Features 特性 |
Benefits 优点 |
Operates over a wide current density range
在宽电流密度范围内工作 |
Uniform plating thickness regardless of part geometry 镀层厚度均匀,不考虑零件几何形状 |
Analyzable additives 可分析的添加剂 |
Easy to maintain and control 易于维护和控制 |
Simplified effluent treatment 简化污水处理 |
Environmentally friendly process 环保工艺 |
High efficiency 效率高 |
Consistent plating rate throughout the life of the bath 在镀液的整个使用寿命中保持一致的镀速 |
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InTech-2000 电镀纯铟 |
Version: 01 Doc.-No.: 201801-001 |
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PROCESS COMPONENTS REQUIRED 所需的工艺组件 |
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InTech -METAL(Concentrate: 300 g/L) MSA Acid (MSA: 950 g/L)
InTech -2000 A
IN-METAL(浓缩:300 g/L) MSA酸(MSA: 950 g/L)
InTech 2000
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Chemicals/Products Required 化学物质/产品要求 |
Optimum 最优 |
InTech -METAL |
167 mL/L |
MSA Acid |
60 mL/L |
InTech -2000 A |
50 mL/L |
Deionized Water |
724 mL/L |
1. Add 500 mL/L Deionized water to tank.
2. Add MSA Acid and allow to mix thoroughly.
3. Add InTech -METAL and allow to mix thoroughly.
4. Add InTech -2000 A and allow to mix thoroughly.
5. Bring solution level up to final volume with Deionized water.
1. 向罐中加入500ml /L去离子水。
2. 加入MSA酸,充分混合。
3. 加入InTech -METAL,充分混合。
4. 加入InTech - 2000a,充分混合。
5.
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We recommend a 10% solution of MSA Acid as an activation step to remove mild oxides and help prevent drag-in of contaminants into the InTech -2000 plating bath.
我们建议使用10%的MSA酸溶液作为活化步骤,以去除温和的氧化物,并有助于防止污染物进入InTech - 2000镀槽。
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InTech-2000 电镀纯铟 |
Version: 01 Doc.-No.: 201801-001 |
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EQUIPMENT 设备 |
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Indium slabs, balls, or chunks, in titanium anode baskets must be kept full to ensure proper corrosion of the anodes. Baskets should be bagged.
钛阳极篮中的铟板、铟球或铟块必须保持满溢,以确保阳极的适当腐蚀。篮子应该装上袋子。
Polypropylene, polyethylene, PVDC, or rubber-lined tanks
聚丙烯,聚乙烯,PVDC,或橡胶内衬罐
Polypropylene, PVC or PVDC
聚丙烯,PVC或PVDC
5 to 30 micron Dynel or polypropylene cartridge with 4 to 5 turnovers per hour. Continuous filtration is recommended to remove any particulate matter which may fall into the bath. Care should be taken to exclude the entrance of air into the filtration system to minimize foaming. 5至30微米的戴奈尔或聚丙烯墨盒,每小时4至5次周转。建议进行连续过滤,以去除可能落入槽内 的任何颗粒物质。应注意防止空气进入过滤系统,以尽量减少起泡。
PTFE, titanium, stainless steel, or silica-sheathed
聚四氟乙烯,钛,不锈钢或硅护套
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InTech-2000 电镀纯铟 |
Version: 01 Doc.-No.: 201801-001 |
设 备 预 处 理 : Solutions Required: 方案要求:
Trisodium Phosphate
磷酸三钠
Sodium Hydroxide
氢氧化钠
MSA Acid MSA 酸
15 g/L (2 oz/gal)
15 g/L (2 oz/gal)
10% v/v (100 mL/L
Whenever a new plating line is set up, or an old line converted to a different chemistry, it is advisable to first thoroughly clean and leach all existing equipment:
每当建立新的电镀生产线,或旧生产线转换为不同的化学,建议首先彻底清洁和浸出所有现有设备:
1. Thoroughly wash all tanks and equipment with deionized water. Discard the water.
2. Fill the tanks with a cleaning solution of 15 g/L (2 oz/gal) trisodium phosphate and 15 g/L (2 oz/gal) sodium hydroxide. Warm to 140 °F and recirculate it for four (4) hours through the system. Discard the solution.
3. Fill the system with deionized water. Recirculate it for two (2) hours through the system, then discard the water.
4. Add a leaching solution of 10 % MSA Acid to the system. Recirculate for eight (8) hours, then discard the leaching solution.
5. Fill the system again with deionized water. Recirculate it for one (1) hour through the system, and then discard the water.
1. 用去离子水彻底清洗所有水箱和设备。把水倒掉。
2. 用15g /L (2 oz/gal)磷酸三钠和15g /L (2 oz/gal)氢氧化钠的清洁溶液填充槽。加热至140°F,通过系统循环四(4)小时。丢弃解决方案。
3. 向系统中注入去离子水。通过系统再循环两(2)小时,然后丢弃水。
4. 在系统中加入10% MSA酸的浸出液。再循环八(8)小时,然后丢弃浸出液。
5.
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Chemicals/Products Required 化学物质/产品要求 |
Range 范围 |
Optimum 最优 |
Indium (III) Metal 金属铟(III) |
40 to 60 g/L |
50 g/L |
Free Methane Sulfonic Acid |
47 to 67g/L |
57 g/L |
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InTech-2000 电镀纯铟 |
Version: 01 Doc.-No.: 201801-001 |
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游离甲烷磺酸 |
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InTech -2000 A InTech 2000 |
40 to 60 mL/L |
50 mL/L |
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Temperature 温度 |
40 to 60 °C (105 to140 °F) |
50 °C (122 °F) |
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Agitation 搅 动 |
Very High, Overflow, Recirculation |
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Cathode Current Density 阴极电流密度 |
5 to 60 ASD (50 to 600 ASF) |
Dependant on equipment design and production requirements |
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Anode to Cathode Ratio1 负极比 |
1:1 to 6:1 |
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Deposition Rate 沉积速率 |
2 to 3 µm/min @ 10 ASD by “Hull cell panel plating” |